ML2 means the maskless lithography. It is necessary to refinement process. Described above, "double / mutiful patterning" in additional cost savings as an alternative to be appropriate. Nano devices with decreasing the size of the unilateral use light to produce a mask for the lithography process takes time and cost. Small production of nano scale patterning process is suitable, and the suitable
(4) Double patterning
The double patterning is divided into four parts, leading with wafer requirements and then two sets of lithographic requirements (Generic Pitch Splitting - Double Patterning Requirements Driven by MPU metal Half-Pitch and Generic Spacer Patterning Requirements - Driven by Flash). The lithography requirements are different for each process; the requirements for pitch splitti
○ PECVD
∙ What is PECVD?
⇒ Radio frequency(RF) is used to induce plasma in the deposition gas.
⇒ This results in a higher deposition rate at relatively low temperatures.
⇒ With the plasma enhanced CVD process is the deposition at temperature around 300℃ allows.
⇒ The temperature will be through encouragement of a plasma with high frequency electric fields triggered.
(1) no effective treatment
(2) lung transplantation
(3) smoking cessation
7) 예후
Factors influencing progression
① cumulative exposure to asbestos
② duration of exposure
③ type of asbestos exposure
3. 탄광부 진폐증 (Coal Worker's Pneumoconiosis)
1) 석탄분진을 흡입하여 발생
2) simple : opacity < 1 cm
The sensory fibers of pulp transmit only pain,
whether the pulp has been cooled or heated
no response
mild to moderate degree of awareness of slight pain that subside within 1-2 sec
strong, momentary painful response that subside within 1-2 sec
moderate to strong painful response that lingers for several sec or longer